Substrate processing apparatus

Details Substrate processing apparatus Substrate processing apparatus

2006-08-01

2006-08-01

Nguyen, Nam (Department: 1753)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S267000

Reexamination Certificate

active

07083706

ABSTRACT:
A substrate processing apparatus comprises a plating section having a plating bath for holding a plating liquid therein, and a head assembly for holding a substrate and immersing the substrate in the plating liquid in the plating bath. A plated film is formed on a surface of the substrate in the plating liquid. The substrate processing apparatus further comprises a cleaning section for cleaning a peripheral edge of the plated substrate and a substrate contact portion held in contact with the substrate, and a drive mechanism for moving the head assembly between the plating section and the cleaning section.

REFERENCES:
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patent: 5092975 (1992-03-01), Yamamura et al.
patent: 5370741 (1994-12-01), Bergman
patent: 6077412 (2000-06-01), Ting et al.
patent: 6258220 (2001-07-01), Dordi et al.
patent: 6309520 (2001-10-01), Woodruff et al.
patent: 6391166 (2002-05-01), Wang
patent: 00/32835 (2000-06-01), None
patent: 01/45144 (2001-06-01), None

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