Abrading – Precision device or process - or with condition responsive... – By optical sensor
Reexamination Certificate
2006-06-27
2006-06-27
Eley, Timothy V. (Department: 3724)
Abrading
Precision device or process - or with condition responsive...
By optical sensor
C451S008000, C451S067000, C451S297000, C451S302000, C451S303000, C451S311000, C451S339000, C451S451000
Reexamination Certificate
active
07066787
ABSTRACT:
A substrate processing apparatus is used for removing surface irregularities occurring on a peripheral portion (a bevel portion, an edge portion, and a notch) of a substrate, such as a semiconductor wafer, and films deposited as a contaminant on the peripheral portion of such a substrate. The substrate processing apparatus includes an edge-portion polisher for pressing a polishing tape against an edge portion of a substrate and causing relative movement between the polishing tape and the substrate to polish the edge portion of the substrate, and a bevel-portion polisher for pressing a polishing tape against a bevel portion of the substrate and causing relative movement between this polishing tape and the substrate to polish the bevel portion of the substrate.
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Ishii You
Nakamura Kenro
Nakanishi Masayuki
Ebara Corporation
Eley Timothy V.
Kabushiki Kaisha Toshiba
Wenderoth , Lind & Ponack, L.L.P.
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