Substrate processing apparatus

Details Substrate processing apparatus Substrate processing apparatus

2005-03-22

2005-03-22

Lorengo, J. A. (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With handle or handgrip

C156S581000, C156S542000, C156S510000, C428S040100, C428S195100, C428S343000, C428S914000

Reexamination Certificate

active

06868889

ABSTRACT:
A substrate processing apparatus includes a frame, first and second supply rolls and a substrate processing assembly including a resiliently deformable structure configured to apply pressure to the first and second supply rolls to perform a substrate processing operation. A method for processing a substrate includes providing first and second supply rolls rotatably mounted to the substrate processing apparatus, wherein at least one of the first and second supply rolls has pressure-sensitive adhesive provided thereon. The selected substrate is enabled to be fed in a substrate receiving opening with the first and the second substrates positioned on opposing sides thereof. The first and second substrates are advanced through the substrate receiving opening. A resiliently deformable structure deforms to apply pressure to the selected substrate and the first and second substrates as they are advanced through the substrate receiving opening, thereby bonding the adhesive to the selected substrate.

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