Substrate processing apparatus

Details Substrate processing apparatus Substrate processing apparatus

2008-05-06

2008-05-06

Shakeri, Hadi (Department: 3723)

Abrading

Machine

Reciprocating tool

C451S065000, C451S006000, C451S173000, C451S444000

Reexamination Certificate

active

07367873

ABSTRACT:
A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.

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