Substrate processing apparatus

Details Substrate processing apparatus Substrate processing apparatus

2011-01-04

2011-01-04

MacArthur, Sylvia R. (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C156S345170, C134S198000

Reexamination Certificate

active

07862680

ABSTRACT:
A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers61, 61, 63for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers61, 62, 63along the peripheral part of the wafer W relatively. The fluid suppliers61, 62, 63are arranged in a direction extending from the circumference of the wafer W to its inside. With the arrangement, the apparatus is capable of stable processing of the wafer W in spite of rotating the wafer W at a low speed. Further, it is possible to improve a throughput of the apparatus in resist processing.

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