Coating apparatus – Control means responsive to a randomly occurring sensed... – Temperature responsive
Reexamination Certificate
1999-07-13
2001-11-20
Edwards, Laura (Department: 1734)
Coating apparatus
Control means responsive to a randomly occurring sensed...
Temperature responsive
C118S667000, C118S712000, C118S058000, C118S319000, C118S320000
Reexamination Certificate
active
06319322
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a substrate processing apparatus for coating, for example, a semiconductor wafer, or an LCD substrate with a resist, and developing it.
2. Description of the Related Art
Conventionally, for example, in a process of photolithography in the fabricating process of a semiconductor device, a resist coating processing for forming a resist coating film on the surface of a semiconductor wafer, and a developing processing for performing development to the wafer after performing exposure to the semiconductor coated with a resist, are carried out. The resist coating and developing are conventionally carried out in accordance with a predetermined sequence adding an exposing process in between in a complex processing system in which various corresponding processing units are installed in one system, for example, as known from Japanese Patent Publication No. Hei 2-30194.
In the semiconductor device, the circuit pattern thereof is recently fined and intended to highly integrate. Therefore, for example, when a predetermined pattern is exposed to the semiconductor wafer by, for example, an aligner such as a stepper, precise positioning is performed to transfer a fine circuit pattern accurately, and precise temperature regulation and the like are performed to prevent displacement due to thermal expansion and heat shrinkage caused by a slight temperature discrepancy.
SUMMARY OF THE INVENTION
As described above, in a process of photolithography for transferring a circuit pattern of a semiconductor device and the like, precise temperature regulation of the semiconductor and the like is performed in an aligner.
However, in the semiconductor device and the like, a further integration is intended and the circuit pattern is made to be finer. Therefore, it is naturally required to intend further precise temperature regulation and improvement in throughput by speeding up processing also in the process of photolithography.
An object of the present invention is to provide a substrate processing apparatus in which further precise temperature regulation and an accurate transfer of a circuit pattern as compared with a conventional one can be performed, and improvement in throughput by speeding up the processing can be intended.
To achieve the above object, the first aspect of the present invention comprises: an aligner for exposing a substrate coated with a resist, while regulating the temperature of the substrate; a coating section for applying a resist to the substrate; a developing section for developing the substrate after exposure; an interface section disposed between the coating section and the developing section, and the aligner, for delivering the substrate between the substrate processing apparatus and the aligner; a transfer means for transferring the substrate between the coating section, the developing section and the interface section; a holding section disposed in the interface section for holding the substrate; and a temperature regulating means for regulating the temperature of the substrate held by the holding section in accordance with the temperature regulation in the aligner.
In the present invention, the temperature regulating means for regulating the temperature of the substrate held by the holding section in accordance with the temperature regulation in the aligner, is provided in the interface section, so that the substrate can be delivered to the aligner in a state where the temperature of the substrate is regulated closer to the temperature required in the aligner in the interface section. Accordingly, the temperature of the substrate can be more accurately regulated in the aligner in a shorter time, so that circuit patterns can be accurately transferred, and throughput can be improved by speeding up the processing.
The second aspect of the present invention comprises: an aligner for exposing a substrate coated with a resist, while regulating the temperature of the substrate; a coating section for applying a resist to the substrate; a developing section for developing the substrate after exposure; an interface section disposed between the coating section and the developing section, and the aligner, for delivering the substrate between the substrate processing apparatus and the aligner; a transfer means for transferring the substrate between the coating section, the developing section and the interface section; a first holding section disposed in the interface section, for holding the substrate before being exposed; a second holding section disposed in the interface section, for holding the substrate after being exposed; a gas supply section for supplying the temperature regulated gas to the first and second holding sections; and a temperature regulating section laid between the first holding section and the gas supply section, for further regulating the temperature of the gas supplied from the gas supply section.
In the present invention, the temperature of the gas, which is supplied from the gas supply section to the first holding section for holding the substrate before being exposed, is further regulated to supply, so that the substrate can be delivered to the aligner in a state where the temperature of the substrate is regulated closer to the temperature required in the aligner, in the interface section. Accordingly, the temperature of the substrate can be more accurately regulated in the aligner in a shorter time, so that circuit patterns can be accurately transferred, and throughput can be improved by speeding up the processing.
These objects and still other objects and advantages of the present invention will become apparent upon reading the following specification when taken in conjunction with the accompanying drawings.
REFERENCES:
patent: 5151871 (1992-09-01), Matsumura et al.
patent: 5707500 (1998-01-01), Shimanura et al.
patent: 5779799 (1998-07-01), Davis
patent: 6183562 (2001-02-01), Pierce et al.
Ito Kazuhiko
Matsushita Michiaki
Ueda Issei
Yamaguchi Tadayuki
Edwards Laura
Rader & Fishman & Grauer, PLLC
Tokyo Electron Limited
LandOfFree
Substrate processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2604524