Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...
Patent
1986-09-10
1987-09-29
Kittle, John E.
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Including a second component containing structurally defined...
428901, B32B 516
Patent
active
046968610
ABSTRACT:
A processed substrate which is adapted to be subjected to electroless plating with a conductive material to produce a metal-plated board for manufacturing a printed-wiring board having a wiring pattern formed of the conductive plating layer. The processed substrate comprises a metal oxide film consisting of fine particles of a reducible metal oxide which are distributed locally only on the surface of the insulating base. Portions of the fine particles are embedded in a skin layer of the insulating base and the remaining portions are exposed over the surface of the insulating base. The process of manufacturing the processed substrate comprises a step of depositing the metal oxide film in a physical vapor deposition process wherein the ionized metal oxide is bombarded onto the surface of the insulating base. The physical vapor deposition process may be a reactive deposition process, an-ion plating process or a sputtering process.
REFERENCES:
patent: 3146125 (1964-08-01), Schneble, Jr. et al.
patent: 4110147 (1978-08-01), Grunwald et al.
patent: 4167582 (1979-09-01), Takahashi et al.
patent: 4247594 (1981-01-01), Shea et al.
patent: 4281038 (1981-07-01), Ambros et al.
patent: 4284684 (1981-08-01), Kubota
patent: 4323599 (1982-04-01), Marshall
Miyabayashi Takeshi
Tatematsu Hiromu
Brother Kogyo Kabushiki Kaisha
Kittle John E.
Ryan Patrick J.
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