Substrate process for an embedded component

Details Substrate process for an embedded component Substrate process for an embedded component

2008-01-11

2010-06-01

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C257SE21502

Reexamination Certificate

active

07727818

ABSTRACT:
A first dielectric layer is formed on a mold having a surface and protruding components and covers the protruding components. At least one electronic component having an active surface, a back surface, and contacts formed on the active surface is disposed on the first dielectric layer. The active surface is faced to the first dielectric layer, and the contacts are corresponding to the protruding components. A second dielectric layer is formed on the first dielectric layer and a carrier is disposed on the back surface of the electronic component. Openings located corresponding to the contacts are further formed within the first dielectric layer by the protruding components in an imprinting step, such that when the mold is removed, the contacts are exposed from the openings.

REFERENCES:
patent: 6503781 (2003-01-01), Stephenson et al.
patent: 7413995 (2008-08-01), Sterrett et al.
patent: 7425464 (2008-09-01), Fay et al.
patent: 2002/0115237 (2002-08-01), Williams
patent: 2005/0260790 (2005-11-01), Goodner et al.
patent: 2007/0264481 (2007-11-01), DeSimone et al.

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