Substrate polishing machine

Abrading – Machine – Rotary tool

Reexamination Certificate

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Details

C451S041000, C451S286000, C451S287000, C451S288000

Reexamination Certificate

active

10481591

ABSTRACT:
There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The substrate carrier comprises a carrier body, a substrate holding member for holding a substrate with a surface of the substrate to be polished being directed towards the polishing surface. The substrate holding member is mounted on the carrier body in such a manner that the substrate holding member is movable both towards and away from the polishing surface. The substrate polishing machine further comprises a substrate holding member positioning device provided on a side of the substrate holding member opposite to that used for holding the substrate. The substrate holding member positioning device has a flexible member which defines a chamber, and which, upon introduction of a non-compressible fluid, is expanded in a direction towards the polishing surface.

REFERENCES:
patent: 5205802 (1993-04-01), Swisher
patent: 5605488 (1997-02-01), Ohashi et al.
patent: 5820448 (1998-10-01), Shamouilian et al.
patent: 6068549 (2000-05-01), Jackson
patent: 6241593 (2001-06-01), Chen et al.
patent: 8-39422 (1996-02-01), None
patent: 10-551 (1998-01-01), None
patent: 10-180626 (1998-07-01), None
patent: 11-226865 (1999-08-01), None
patent: 2000-288923 (2000-10-01), None

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