Substrate polishing apparatus

Details Substrate polishing apparatus Substrate polishing apparatus

2006-09-05

2006-09-05

Shakeri, Hadi (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S009000, C451S285000

Reexamination Certificate

active

07101257

ABSTRACT:
A substrate polishing apparatus polishes a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed and a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate. The substrate polishing apparatus also has a fluid supply passage for supplying a fluid for measurement, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the fluid for measurement to the fluid chamber.

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patent: 2001/0005265 (2001-06-01), Kimba et al.
patent: 2003/0181139 (2003-09-01), Lehman et al.

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