Substrate polishing apparatus

Details Substrate polishing apparatus Substrate polishing apparatus

2005-09-13

2005-09-13

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S010000, C451S011000, C451S285000, C156S345130

Reexamination Certificate

active

06942543

ABSTRACT:
The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

REFERENCES:
patent: 5609511 (1997-03-01), Moriyama et al.
patent: 5657123 (1997-08-01), Mogi et al.
patent: 5708506 (1998-01-01), Birang
patent: 6106662 (2000-08-01), Bibby, Jr. et al.
patent: 6111634 (2000-08-01), Pecen et al.
patent: 6280290 (2001-08-01), Birang et al.
patent: 6599765 (2003-07-01), Boyd et al.
patent: 6609947 (2003-08-01), Moore
patent: 6628397 (2003-09-01), Nikoonahad et al.
patent: 6657737 (2003-12-01), Kimba et al.
patent: 6671051 (2003-12-01), Nikoonahad et al.
patent: 2000-254860 (2000-09-01), None
patent: 2001-88021 (2001-04-01), None
patent: 2001-235311 (2001-08-01), None
patent: 01/20304 (2001-03-01), None

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