Abrading – Precision device or process - or with condition responsive... – By optical sensor
Reexamination Certificate
2004-05-19
2009-06-16
Wilson, Lee D (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
By optical sensor
C451S005000, C451S285000
Reexamination Certificate
active
07547242
ABSTRACT:
A substrate polishing apparatus polishes a substrate to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed, a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate, a fluid supply passage for supplying a measurement fluid, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the measurement fluid to the fluid chamber.
REFERENCES:
patent: 5657123 (1997-08-01), Mogi et al.
patent: 5672091 (1997-09-01), Takahashi et al.
patent: 5762536 (1998-06-01), Pant et al.
patent: 5838447 (1998-11-01), Hiyama et al.
patent: 5893796 (1999-04-01), Birang et al.
patent: 5958148 (1999-09-01), Holzapfel et al.
patent: 6000996 (1999-12-01), Fujiwara
patent: 6045439 (2000-04-01), Birang et al.
patent: 6106662 (2000-08-01), Bibby, Jr. et al.
patent: 6334807 (2002-01-01), Lebel et al.
patent: 6361646 (2002-03-01), Bibby, Jr. et al.
patent: 6433541 (2002-08-01), Lehman et al.
patent: 6491569 (2002-12-01), Bibby, Jr. et al.
patent: 6537133 (2003-03-01), Birang et al.
patent: 6544104 (2003-04-01), Koike et al.
patent: 6599765 (2003-07-01), Boyd et al.
patent: 6614529 (2003-09-01), Tang
patent: 6621264 (2003-09-01), Lehman et al.
patent: 6628397 (2003-09-01), Nikoonahad et al.
patent: 6671051 (2003-12-01), Nikoonahad et al.
patent: 6707540 (2004-03-01), Lehman et al.
patent: 6733368 (2004-05-01), Pan et al.
patent: 6758723 (2004-07-01), Kobayashi et al.
patent: 6785010 (2004-08-01), Kimba et al.
patent: 6942543 (2005-09-01), Kobayashi et al.
patent: 7101257 (2006-09-01), Hirokawa et al.
patent: 2001/0005265 (2001-06-01), Kimba et al.
patent: 2002/0016066 (2002-02-01), Birang et al.
patent: 2003/0181139 (2003-09-01), Lehman et al.
patent: 1 108 979 (2001-06-01), None
patent: 1 118 431 (2001-07-01), None
patent: 10-229061 (1998-08-01), None
patent: 2001-88021 (2001-04-01), None
patent: 01/15861 (2001-03-01), None
patent: 01/20304 (2001-03-01), None
patent: 01/46684 (2001-06-01), None
patent: 01/81902 (2001-11-01), None
Hirokawa Kazuto
Kobayashi Yo-ichi
Nakai Shunsuke
Ohta Shinrou
Tsukuda Yasuo
Ebara Corporation
Shimadzu Corporation
Wenderoth , Lind & Ponack, L.L.P.
Wilson Lee D
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