Substrate plating method and apparatus

Details Substrate plating method and apparatus Substrate plating method and apparatus

2006-04-25

2006-04-25

Phasge, Arun S. (Department: 1753)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S212000, C204S22400M, C204S232000, C204S242000, C204S273000, C204S275100

Reexamination Certificate

active

07033463

ABSTRACT:
A method and apparatus plate a substrate to form wiring by efficiently filling a fine recess formed in a semiconductor substrate with plating metal without a void or contamination. The plating of the substrate to fill a wiring recess formed in the semiconductor substrate with plating metal includes performing an electroless plating process of forming an initial layer on the substrate, and performing an electrolytic plating process of filling the wiring recess with the plating metal, while the initial layer serves as a feeding layer.

REFERENCES:
patent: 3716462 (1973-02-01), Jensen
patent: 3776770 (1973-12-01), Lando
patent: 3833486 (1974-09-01), Nobel et al.
patent: 3930963 (1976-01-01), Polichette et al.
patent: 4303443 (1981-12-01), Miyazawa et al.
patent: 4666735 (1987-05-01), Hoover et al.
patent: 4956097 (1990-09-01), Courduvelis
patent: 5116430 (1992-05-01), Hirai et al.
patent: 5433840 (1995-07-01), Dahms et al.
patent: 5437777 (1995-08-01), Kishi
patent: 5849171 (1998-12-01), Dahms et al.
patent: 5932077 (1999-08-01), Reynolds
patent: 6017437 (2000-01-01), Ting et al.
patent: 6091498 (2000-07-01), Hanson et al.
patent: 6117784 (2000-09-01), Uzoh
patent: 6140234 (2000-10-01), Uzoh et al.
patent: 6143155 (2000-11-01), Adams et al.
patent: 6156167 (2000-12-01), Patton et al.
patent: 6235634 (2001-05-01), White et al.
patent: 6254760 (2001-07-01), Shen et al.
patent: 6258220 (2001-07-01), Dordi et al.
patent: 6258223 (2001-07-01), Cheung et al.
patent: 6267853 (2001-07-01), Dordi et al.
patent: 6294059 (2001-09-01), Hongo et al.
patent: 6309524 (2001-10-01), Woodruff et al.
patent: 2002/0029961 (2002-03-01), Dordi et al.
patent: 1222969 (1971-02-01), None
patent: 51-149131 (1976-12-01), None
patent: 56-158424 (1981-12-01), None
patent: 56-161221 (1981-12-01), None
patent: 62-235499 (1987-10-01), None
patent: 63-26400 (1988-02-01), None
patent: 63026400 (1988-02-01), None
patent: 2-341 (1990-01-01), None
patent: 3-146698 (1991-06-01), None
patent: 03146698 (1991-06-01), None
patent: 5-98500 (1993-04-01), None
patent: 5-311496 (1993-11-01), None
patent: 5-331653 (1993-12-01), None
patent: 05331653 (1993-12-01), None
patent: 7-193214 (1995-07-01), None

Affiliated with

Also associated with

Rating

Substrate plating method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate plating method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate plating method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3560122