Substrate plating device having laminar flow

Details Substrate plating device having laminar flow Substrate plating device having laminar flow

1994-08-18

1996-05-07

Valentine, Donald R.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204239, 204273, 204284, 204275, 204297R, C25D 508, C25D 1700

Patent

active

055142583

ABSTRACT:
The present invention provides an apparatus for electrodepositing metals onto a substrate or the like which creates a uniform laminar flow of the electroplating solution across the surface of the substrate. Specifically, the plating bath according to this invention utilizes an insert plate with a plurality of conical-shaped apertures and a cylindrical tunnel plate to create and maintain a laminar flow of the solution across the surface of the substrate. Additionally, every plate in the invention can be separately and slidably removed to facilitate easy disassembly for cleaning and user customization to achieve the various results and specifications desired by the user.

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