Substrate plating apparatus

Details Substrate plating apparatus Substrate plating apparatus

2005-08-16

2005-08-16

Valentine, Donald R. (Department: 1742)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S22400M, C204S269000, C204S270000, C118S066000, C118S423000, C118S429000

Reexamination Certificate

active

06929722

ABSTRACT:
A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit are combined into a unitary arrangement.

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