Substrate package structure and packaging method thereof

Details Substrate package structure and packaging method thereof Substrate package structure and packaging method thereof

2008-07-29

2008-07-29

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S778000, C257SE23069

Reexamination Certificate

active

07405478

ABSTRACT:
A substrate package structure includes bumps disposed on a surface side of a first substrate and a surface side of a second substrate. The bump at the first substrate and the bump at the second substrate are press-fitted to each other while the one surface of the first substrate and the one surface of the second substrate are confronted to each other, thereby connecting the first and second substrates to each other. The bump at the first substrate is constructed so that the tip portion thereof is designed to have a flat surface, and the bump at the second substrate is constructed so that the tip portion is designed to have a projecting portion narrower than the tip portion of the bump at the first substrate.

REFERENCES:
patent: 4878611 (1989-11-01), LoVasco et al.
patent: 5186383 (1993-02-01), Melton et al.
patent: 5220200 (1993-06-01), Blanton
patent: 5990418 (1999-11-01), Bivona et al.
patent: 6310421 (2001-10-01), Morishima
patent: 2004/0212101 (2004-10-01), Pendse
patent: 2004/0217767 (2004-11-01), DiOrio et al.
patent: A-4-340240 (1992-11-01), None
patent: A-6-204293 (1994-07-01), None
patent: A-9-232366 (1997-09-01), None
patent: A-2002-93848 (2002-03-01), None
patent: A-2002-261116 (2002-09-01), None

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