Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...
Patent
1983-03-28
1985-01-08
Lesmes, George F.
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Including a second component containing structurally defined...
428418, 428460, 428458, 428461, 428419, 4284735, 428901, B32B 1508, B32B 2736, B32B 2728
Patent
active
044927304
ABSTRACT:
The present invention relates to a substrate for a printed circuit exhibiting particularly an excellent electrical insulating property, as well as an excellent heat dissipating property and heat resistance.
In accordance with the present invention, a substrate of a printed circuit comprises a metallic plate, and further comprising on at least one surface of said metallic plate, a synthetic resin layer containing an inorganic filler, a heat-resistant resin film, and a synthetic resin layer, which are successively laminated on said metallic plate.
A substrate of the present invention also comprises a metallic plate, at least two synthetic resin layers containing an inorganic filler, a heat-resistant resin film which is laminated between said at least two synthetic resin layers.
REFERENCES:
patent: 2798823 (1957-07-01), Harper
patent: 3278455 (1966-10-01), Feather
patent: 3784440 (1974-01-01), Grunwald et al.
patent: 3801427 (1974-04-01), Morishita et al.
patent: 4009312 (1977-02-01), Hayashi et al.
patent: 4205111 (1980-05-01), Pip et al.
patent: 4264669 (1981-04-01), Yuan
patent: 4329399 (1982-05-01), Swerlick
Chem. Abstracts 96:218641p-BT resins.
Harada Shoji
Oishi Naoaki
Shimizu Noriyuki
Shoji Takashi
Lesmes George F.
Nikkan Industries Co., Ltd.
Showa Denko Kabushiki Kaisha
Swisher Nancy A. B.
LandOfFree
Substrate of printed circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate of printed circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate of printed circuit will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-113386