Substrate of and core for photosensitive material

Details Substrate of and core for photosensitive material Substrate of and core for photosensitive material

1992-02-14

1994-02-15

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Radiation sensitive product

Structurally defined

430496, 430934, 242 71, 242 711, G03C 300

Patent

active

052866149

ABSTRACT:
A substrate of a photosensitive web material of which the base end portion is gradually thinned toward the base end a core for a rolled photographic film which comprises a core body and a crosslinked foamed sheet having an expansion ratio of 18 to 45 times and a thickness of 0.2 to 2.0 mm which contains more than 50 wt. % in the sum of one or more members selected from the group consisting of polyethylene resin having a density of less than 0.930 g/cm.sup.3, ethylenevinyl acetate copolymer resin having a comonomer content of less than 25 wt. % and ethylene-ethyl arcylate copolymer resin having a comonomer content of less than 25 wt. % is disposed on the surface of the core body. The substrate and core sharply reduce the occurrence of marking troubles and pressure mark troubles on the photosensitive web material near the core caused by the difference in levels induced by the base end portion of the web.

REFERENCES:
patent: 3515558 (1970-06-01), Winkler
patent: 4021001 (1977-05-01), Sproat
patent: 4697757 (1987-10-01), Nakaya et al.
patent: 5046681 (1991-09-01), Niedospial
Patent Abstracts of Japan vol. 12, No. 463, 6 Dec. 1988 & JPA 63184752.

Affiliated with

Also associated with

Rating

Substrate of and core for photosensitive material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate of and core for photosensitive material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate of and core for photosensitive material will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1206121