Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-11-03
1997-03-11
Ledynh, Bot L.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361760, 361772, 361774, 257784, 29832, H05K 118, H01R 900
Patent
active
056108001
ABSTRACT:
A system for packaging circuit components is disclosed. The system includes a substrate having a plurality of openings to accommodate mounting various circuit components and the circuit components mounted therein. The substrate has first, second, third and fourth contacts providing mechanical and electrical connection to the various components. An opening is provided for accommodating a first auxiliary component such as a battery wherein the battery terminals attach to the first and second contacts. Another opening is provided in the substrate to accommodate a second auxiliary component such as a crystal resonator having leads which attach to the third and fourth contacts. The substrate preferably has another opening for accommodating an integrated circuit chip package, the chip package having conventional leads for mounting to a circuit board and terminals for connecting to the substrate contacts. Lockout tabs are also preferably provide on the substrate and chip package to ensure proper mounting of the chip package to the substrate and proper electrical connection of the chip package to the components on the substrate.
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Ser. No. 07/995,665 filed Dec. 21, 1992 by Dixon et al.
Ser. No. 08/225/227 filed Apr. 8, 1994 by Siegel et al.
Hundt Michael J.
Siegel Harry M.
Galanthay Theodore E.
Jorgenson Lisa K.
Ledynh Bot L.
SGS-Thomson Microelectronics Inc.
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