Substrate mounting assembly

Details Substrate mounting assembly Substrate mounting assembly

1988-01-04

1989-01-03

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165185, 174 163, 357 81, 361388, H05K 720

Patent

active

047961570

ABSTRACT:
In a substrate mounting assembly (10) critical bonding pads (20) adjacent one lateral edge (21) of a ceramic substrate (11) are connected to semiconductor die (13) via wires (26). The substrate and die are mounted on a aluminum base carrier plate (12) which serves as a heat sink for the semiconductor die. A relatively rigid first adhesive (40) is applied in one area between the substrate and base carrier so as to effectively fix one lateral edge (21) of the substrate and the critical bonding pads (20) with respect to the base carrier, while a second adhesive (41), comprising an acrylic adhesive tape, bonds other areas of the ceramic substrate to the base carrier. At a lateral edge (23) of the substrate opposite to the lateral edge (21) adjacent the critical bonding pads, additional bonding pads (22) are provided and wires/conductors (27) connect these additional bonding pads to lead frame projections (28) from a non-conductive housing (29) fixed to the aluminum base carrier. This configuration insures sufficient mechanical support for the ceramic substrate while also providing minimal stress for the wires connecting the semiconductor die to the critical bonding pads.

REFERENCES:
Motorola TFI-IV Assembly Drawing.

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