Substrate, method of preparing a substrate, method of...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having substrate registration feature

Reexamination Certificate

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C438S975000, C257S797000

Reexamination Certificate

active

10724403

ABSTRACT:
In a method according to one embodiment of the invention, a plurality of markers are printed in resist on a substrate at a range of angles relative to a crystal axis of the substrate. The markers are etched in to the substrate using an anisotropic etch process, such that after the etch the apparent positions of the markers are dependent on their orientation relative to the crystal axis. The apparent positions of the markers are measured, and from this information the orientation of the crystal axis is derived.

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