Substrate method and apparatus

Details Substrate method and apparatus Substrate method and apparatus

2005-06-07

2005-06-07

Brock, II, Paul E (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Magnetic field

C257S774000

Reexamination Certificate

active

06903431

ABSTRACT:
This invention relates to an apparatus and methods for reducing the impedance mismatch problem encountered by differential signaling in conductive core substrates, while maintaining adherence to the common mode noise assumption. Specifically, the conductive paths that traverse through the conductive core are separated by a nonconductive material which minimize impedance and interruption of the signal coupling.

REFERENCES:
patent: 5208068 (1993-05-01), Davis et al.
patent: 6239485 (2001-05-01), Peters et al.
patent: 2004/0110382 (2004-06-01), Chakravorty
patent: 2000164765 (2000-06-01), None
Brooks, D., “Differential Signals: The Differential Difference!,” CMP Media, UltraCAD Design, Inc., May 2001, 2 pgs.
NG, E. et al., “Low Power Gbit/sec Low Voltage Differential Signaling I/O System,” Electrical Engineering and Computer Science, University of California, Berkeley, 7 pgs.
Parker, K., “A Signaling Primer,” Apr. 24, 2004, 8 pgs.
“Inside Differential Signals,” Cadence community Educational Series, Dec. 2001, 3 pgs.

Affiliated with

Also associated with

Rating

Substrate method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3503328