Substrate mapping

Details Substrate mapping Substrate mapping

2006-04-04

2006-04-04

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

Reexamination Certificate

active

07022533

ABSTRACT:
A method for fabricating semiconductor die packages including a mounting substrate and dice attached thereto. The mounting substrate includes multiple die attach sites and a designator having substrate identification information. The die attach sites are evaluated and categorized as either good or defective die attach sites, wherein the evaluated information is saved in an electronic file as mapped information. A die is attached to the die attach sites in accord with the information, wherein known good dice are attached to the good die attach sites and known defective dice are attached to the defective die attach sites. The assembly is then encapsulated in a transfer molding operation.

REFERENCES:
patent: 4426341 (1984-01-01), Tsuzuku et al.
patent: 4437229 (1984-03-01), Bitler et al.
patent: 4510673 (1985-04-01), Shils et al.
patent: 4554126 (1985-11-01), Sera
patent: 4585931 (1986-04-01), Duncan et al.
patent: 4787143 (1988-11-01), Yagi et al.
patent: 5172053 (1992-12-01), Itoyama
patent: 5175425 (1992-12-01), Spratte et al.
patent: 5181097 (1993-01-01), Ogata et al.
patent: 5197650 (1993-03-01), Monzen et al.
patent: 5256578 (1993-10-01), Corley et al.
patent: 5645787 (1997-07-01), Taruno et al.
patent: 5654204 (1997-08-01), Anderson
patent: 5872398 (1999-02-01), King et al.
patent: 5998243 (1999-12-01), Odashima et al.
patent: 6001672 (1999-12-01), Wensel
patent: 6021380 (2000-02-01), Fredriksen et al.
patent: 6052798 (2000-04-01), Jeddeloh
patent: 6090644 (2000-07-01), Moden
patent: 6106259 (2000-08-01), Lee et al.
patent: 6111324 (2000-08-01), Sheppard et al.
patent: 6117382 (2000-09-01), Thummel
patent: 6192457 (2001-02-01), Porterfield
patent: 6268641 (2001-07-01), Yano et al.
patent: 6391666 (2002-05-01), Huang et al.
patent: 6415977 (2002-07-01), Rumsey
patent: 6547902 (2003-04-01), Arai et al.
patent: 6555400 (2003-04-01), Farnworth et al.
patent: 6808947 (2004-10-01), Farnworth et al.
Lau, Flip Chip Technologies for MCM Applications, 1996, McGraw-Hill, pps. 24-25.

Affiliated with

Also associated with

Rating

Substrate mapping does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate mapping, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate mapping will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3612359