Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
Reexamination Certificate
2007-01-30
2008-08-05
Osele, Mark A (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Presses or press platen structures, per se
C156S345420, C438S458000, C083S468100, C083S468930
Reexamination Certificate
active
07406994
ABSTRACT:
An automatic high-precision layer cutting device for separating a layer from a semiconductor substrate. The device includes a fixed positioning member for receiving at least a portion of a semiconductor substrate that has a weakened area therein and a peripheral annular notch located below the weakened area. The positioning member maintains the position of the substrate on a moveable support. A cutting mechanism having at least one blade is provided for contacting the substrate and inducing a cleaving wave therein. The cutting mechanism is operatively associated with the positioning member so that the as at least one blade contacts the annular notch, the positioning member prevents movement of the substrate and the moveable support moves away from the substrate to allow the cleaving wave to both divide the substrate at the notch into first and second parts and detach the layer from the substrate along the weakened area.
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Barge Thierry
Berne Cecile
Lagahe-Blanchard Chrystelle
Martinez Muriel
Rayssac Olivier
Osele Mark A
S.O.I.Tec Silicon on Insulator Technologies
Winston & Strawn LLP
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