Substrate isolation for analog/digital IC chips

Details Substrate isolation for analog/digital IC chips Substrate isolation for analog/digital IC chips

1997-03-11

1998-08-11

Prenty, Mark V.

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Including dielectric isolation means

257620, H01L 2900

Patent

active

057930937

ABSTRACT:
The specification describes techniques for isolating noisy subcircuits in integrated analog/digital devices. The isolating means are trenches formed in the backside of the chip, and extending through, or partially through, the chip substrate. The isolating trenches are configured to be discontinuous so that the structural integrity of the chip, and the wafer as the chips are processed, is preserved.

REFERENCES:
patent: 5623159 (1997-04-01), Monk et al.

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