Substrate interconnect allowing personalization using spot surfa

Electricity: electrical systems and devices – Miscellaneous

Patent

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Details

174255, 174261, 361400, 361403, 361414, 361417, 257700, H05K 702

Patent

active

052204901

ABSTRACT:
A customizable interconnect circuit wherein a universal substrate of minimum layers is completely customized by programmable conductive links placed only on the top layer of the substrate. The customizable circuit having high density of orthogonally placed X- and Y-conductors capable of interconnecting closely spaced large-scale integrated circuits or discrete electrical components. By utilizing a plurality of interconnect cells regularly spaced throughout a universal, fixed substrate, interconnect routing from overlying electrical components or integrated circuits can be more directly routed to target areas.

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