Substrate impedance measurement

Details Substrate impedance measurement Substrate impedance measurement

2005-05-10

2005-05-10

Pert, Evan (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S537000

Reexamination Certificate

active

06891392

ABSTRACT:
A probe structure for testing impedance of a package substrate using time domain reflectometry. A connector electrically connects the probe structure to a time domain reflectometry tester, where the connector has a signal conductor and a ground conductor. An electrically conductive cantilever signal pin is electrically connected to the signal conductor. The electrically conductive cantilever signal pin has a tip for making an electrical connection with an electrically conductive structure to be tested on the package substrate. The electrically conductive cantilever signal pin is electrically isolated by and sheathed within a ground shield that is electrically connected to at least one of the ground conductor and electrically conductive cantilever ground pins. The electrically conductive cantilever ground pins are electrically connected to the ground conductor. The electrically conductive cantilever ground pins also have tips, for making electrical connections with electrically conductive structures on the package substrate that surround the electrically conductive structure to be tested on the package substrate.

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