Substrate holding apparatus and polishing apparatus

Details Substrate holding apparatus and polishing apparatus Substrate holding apparatus and polishing apparatus

2004-02-25

2008-12-16

Wilson, Lee D (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

C451S041000, C451S005000, C451S008000

Reexamination Certificate

active

07465214

ABSTRACT:
A substrate holding apparatus holds a substrate such as a semiconductor and presses the substrate against a polishing surface. The substrate holding apparatus includes a top ring body (2) for holding the substrate, a plurality of fluid passages (33, 34, 35, 36) for supplying a fluid to a plurality of pressure chambers (22, 23, 24, 25) defined in the top ring body, and a plurality of sensors (S1, S2, S3, S4) disposed in the fluid passages, respectively, for detecting flowing states of the fluid which flows through the fluid passages.

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