Substrate holding apparatus and polishing apparatus

Details Substrate holding apparatus and polishing apparatus Substrate holding apparatus and polishing apparatus

2006-09-19

2006-09-19

Morgan, Eileen P. (Department: 3723)

Abrading

Machine

Rotary tool

C451S287000, C451S288000, C451S398000

Reexamination Certificate

active

07108592

ABSTRACT:
The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus includes a vertically movable top ring body for holding the substrate, and an elastic membrane for defining a pressure chamber in the top ring body. A coating is applied to a surface of the elastic membrane which is brought into contact with the substrate.

REFERENCES:
patent: 5908347 (1999-06-01), Nakajima et al.
patent: 6293858 (2001-09-01), Kimura et al.
patent: 6336851 (2002-01-01), Shendon
patent: 6367529 (2002-04-01), Yanagisawa
patent: 6514124 (2003-02-01), Zuniga et al.
patent: 6612903 (2003-09-01), Korovin et al.
patent: 6652368 (2003-11-01), Shendon et al.
patent: 6719618 (2004-04-01), Homma et al.
patent: 6746312 (2004-06-01), Torii et al.

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