Substrate holding apparatus and polishing apparatus

Details Substrate holding apparatus and polishing apparatus Substrate holding apparatus and polishing apparatus

2011-01-11

2011-01-11

Rose, Robert (Department: 3727)

Abrading

Machine

Rotary tool

C451S388000, C451S398000

Reexamination Certificate

active

07867063

ABSTRACT:
A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.

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