Substrate holder, plating apparatus, and plating method

Details Substrate holder, plating apparatus, and plating method Substrate holder, plating apparatus, and plating method

2004-12-03

2010-10-05

Van, Luan V (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C205S157000

Reexamination Certificate

active

07807027

ABSTRACT:
A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.

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