Substrate holder for a plasma processing system

Electric heating – Metal heating – By arc

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Details

21912158, 118725, 165 802, B23K 1000

Patent

active

059582650

ABSTRACT:
To eliminate variations in process characteristics by suppressing variations in the temperature of a characteristic correction ring as time passes, a substrate holder holds a substrate 10 while the desired process is performed on the substrate 10 with plasma P. The substrate holder is equipped with a holder main body 1 that holds the substrate 10 in planar contact with a substrate holding surface 20. A substrate temperature regulation mechanism 5 regulates the temperature of the substrate 10 by exchanging heat across the substrate holding surface 20, and a characteristic correction ring 9 surrounds the substrate 10 and corrects variations in process characteristics at the peripheral parts of the substrate 10, wherein the characteristic correction ring 9 is provided with a ring cooling mechanism that prevents the characteristic correction ring 9 from storing up heat from the plasma P and increasing in temperature as time passes. The substrate temperature regulation mechanism 5 also serves as a ring cooling means, being configured with the ability to cool the substrate 10 by causing a temperature medium to circulate inside the holder main body 1, and is provided with a contact improvement means, such as a static adhesion mechanism 6 which improves the thermal contact of the characteristic correction ring 9 against holder main body 1.

REFERENCES:
patent: 5094885 (1992-03-01), Selbrede
patent: 5267607 (1993-12-01), Wada
patent: 5571366 (1996-11-01), Ishii
patent: 5775416 (1998-07-01), Heimanson et al.
patent: 5868848 (1999-02-01), Tsukamoto

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