Substrate heating method utilizing heating element control to ac

Details Substrate heating method utilizing heating element control to ac Substrate heating method utilizing heating element control to ac

1991-11-14

1993-08-24

Reynolds, Bruce A.

Electric resistance heating devices

Heating devices

Radiant heater

118725, 118730, 219390, H01L 21205, H01L 2122

Patent

active

052396142

ABSTRACT:
A heat-treating method comprising preparing a plurality of wafers parallel to one another in a process tube while keeping their surfaces to be treated substantially horizontal, arranging plural MoSi.sub.2 wire heaters along the longitudinal axis of the process tube so as to be placed around the process tube, adjusting the amount of current supplied to the heaters to form on the treated surface of each of the wafers temperature gradient extending from one side of the outer circumferential rim of each of the wafers to the other side thereof, and rotating the wafers in their surfaces.

REFERENCES:
patent: 3140965 (1964-07-01), Reuschel
patent: 4062318 (1977-12-01), Ban et al.
patent: 4306515 (1981-12-01), Winkler
patent: 4609343 (1986-09-01), Tejfalussy
patent: 4680451 (1987-07-01), Gat et al.
patent: 4745088 (1988-05-01), Inoue et al.
patent: 4789771 (1988-12-01), Robinson et al.
patent: 4823735 (1989-04-01), Pichel et al.
patent: 4886954 (1989-12-01), Yu et al.
patent: 4926793 (1990-05-01), Arima et al.
patent: 4937434 (1990-06-01), Nakao
patent: 4950870 (1990-08-01), Mitsuhasi et al.
patent: 4954684 (1990-09-01), Aoki et al.
patent: 5001327 (1991-03-01), Hirasawa et al.
patent: 5070815 (1991-12-01), Kasai et al.

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