Substrate heating apparatus and multi-chamber substrate...

Details Substrate heating apparatus and multi-chamber substrate... Substrate heating apparatus and multi-chamber substrate...

2006-03-28

2006-03-28

Fuqua, Shawntina (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C219S405000, C219S411000, C392S416000, C392S418000, C118S724000, C118S725000, C118S050100

Reexamination Certificate

active

07019263

ABSTRACT:
This application discloses a substrate heating apparatus comprising a partition separating the inside of a load-lock chamber into two areas. An inside opening provided in the partition is closed by a partition valve, while the second area in which a substrate is transferred is evacuated at a vacuum pressure by a pumping line. After the partition valve is opened, a carrier carries the substrate through the inside opening, thereby contacting the substrate onto a heat body disposed in the first area. Otherwise, after the partition valve is opened, a carrier carries a heat body through the inside opening, thereby contacting the substrate onto the heat body in the second area. This application also discloses a substrate processing system comprising a transfer chamber, and a load-lock chamber and a process chamber both provided on the periphery of the transfer chamber.

REFERENCES:
patent: 6843202 (2005-01-01), Kusuda
patent: 6896513 (2005-05-01), Bachrach et al.
patent: 6900413 (2005-05-01), Ratliff et al.
patent: 11-506821 (1999-06-01), None
patent: 2003-13215 (2003-01-01), None

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