Substrate having repaired metallic pattern and method and...

Details Substrate having repaired metallic pattern and method and... Substrate having repaired metallic pattern and method and...

2005-04-05

2005-04-05

Cooke, Colleen P. (Department: 1754)

Electric heating

Metal heating

By arc

C428S209000

Reexamination Certificate

active

06875952

ABSTRACT:
Paste comprising metallic organic compound, in particular, gold-based metallic organic compound is used as a conductive material for repairing open defects in a metal pattern. After applying the paste, the paste is baked to deposit a metal film. This can produce a very thin metallic film having low electric resistance. Further, a semiconductor laser is used as a heating unit to heat only the paste applied to the open defect. A heating profile having a multi-step baking process includes a provisional baking and main baking process followed by a cooling process to produce a high-quality thin metallic film having no cracks and a dense texture.

REFERENCES:
patent: 4187128 (1980-02-01), Bilings et al.
patent: 4609566 (1986-09-01), Hongo et al.
patent: 4636403 (1987-01-01), Fisanick et al.
patent: 4859256 (1989-08-01), Sawa et al.
patent: 5079070 (1992-01-01), Chalco et al.
patent: 5145714 (1992-09-01), Reisman et al.
patent: 5164565 (1992-11-01), Addiego et al.
patent: 5182230 (1993-01-01), Donelon et al.
patent: 5318869 (1994-06-01), Hashimoto et al.
patent: 5464990 (1995-11-01), Shiratsuki et al.
patent: 5738733 (1998-04-01), Inoue
patent: 5821627 (1998-10-01), Mori et al.
patent: 5872610 (1999-02-01), Kobayashi
patent: 5883437 (1999-03-01), Maruyama et al.
patent: 6035526 (2000-03-01), Saruta et al.
patent: 6143095 (2000-11-01), Kim et al.
patent: 6165649 (2000-12-01), Grenon et al.
patent: 219838 (1990-01-01), None
patent: 267517 (1990-03-01), None
patent: 2301723 (1990-12-01), None
patent: 3-85523 (1991-04-01), None
patent: 04-243231 (1992-08-01), None

Affiliated with

Also associated with

Rating

Substrate having repaired metallic pattern and method and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate having repaired metallic pattern and method and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate having repaired metallic pattern and method and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3442576