Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal
Reexamination Certificate
2011-03-29
2011-03-29
Toledo, Fernando L (Department: 2895)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
C438S200000, C438S715000, C438S782000
Reexamination Certificate
active
07915058
ABSTRACT:
The present invention provides a method for manufacturing a substrate having a pattern that is capable of controlling the distance between adjacent film patterns, and also provides a method for manufacturing a substrate, particularly, having a pattern with a narrow width and a thickness that is capable of controlling the width between the film patterns. The present invention provides a method for manufacturing a substrate having a conductive film that serves as an antenna with a little variation in inductance and has a large electromotive force, and provides a method for manufacturing a semiconductor device with high yield. After forming a film in which silicon and oxygen are combined and an inactive group is combined with the silicon over a substrate, an insulating film, or a conductive film, a composition is printed by the printing method thereover, and is baked to form a film pattern.
REFERENCES:
patent: 3793717 (1974-02-01), Degenkolb et al.
patent: 5200846 (1993-04-01), Hiroki et al.
patent: 5218464 (1993-06-01), Hiroki et al.
patent: 5289030 (1994-02-01), Yamazaki et al.
patent: 5308998 (1994-05-01), Yamazaki et al.
patent: 5468987 (1995-11-01), Yamazaki et al.
patent: 5474945 (1995-12-01), Yamazaki et al.
patent: 5478460 (1995-12-01), Sugama et al.
patent: 5485019 (1996-01-01), Yamazaki et al.
patent: 5495121 (1996-02-01), Yamazaki et al.
patent: 5521107 (1996-05-01), Yamazaki et al.
patent: 5545571 (1996-08-01), Yamazaki et al.
patent: 5650338 (1997-07-01), Yamazaki et al.
patent: 5716871 (1998-02-01), Yamazaki et al.
patent: 5821559 (1998-10-01), Yamazaki et al.
patent: 5834840 (1998-11-01), Robbins et al.
patent: 5849611 (1998-12-01), Yamazaki et al.
patent: 5854494 (1998-12-01), Yamazaki et al.
patent: 5879969 (1999-03-01), Yamazaki et al.
patent: 5894151 (1999-04-01), Yamazaki et al.
patent: 5899709 (1999-05-01), Yamazaki et al.
patent: 5913112 (1999-06-01), Yamazaki et al.
patent: 5917225 (1999-06-01), Yamazaki et al.
patent: RE36314 (1999-09-01), Yamazaki et al.
patent: 5962870 (1999-10-01), Yamazaki et al.
patent: 6013928 (2000-01-01), Yamazaki et al.
patent: 6028333 (2000-02-01), Yamazaki et al.
patent: 6147375 (2000-11-01), Yamazaki et al.
patent: 6210750 (2001-04-01), Cho et al.
patent: 6235383 (2001-05-01), Hong et al.
patent: 6291022 (2001-09-01), Hong et al.
patent: 6323528 (2001-11-01), Yamazaki et al.
patent: 6326642 (2001-12-01), Yamazaki et al.
patent: 6331723 (2001-12-01), Yamazaki et al.
patent: 6337133 (2002-01-01), Akamatsu et al.
patent: 6476447 (2002-11-01), Yamazaki et al.
patent: 6525261 (2003-02-01), Kubota et al.
patent: 6566711 (2003-05-01), Yamazaki et al.
patent: 6580035 (2003-06-01), Chung
patent: 6624450 (2003-09-01), Yamazaki et al.
patent: 6630080 (2003-10-01), Matsumora
patent: 6641654 (2003-11-01), Akamatsu et al.
patent: 6709907 (2004-03-01), Yamazaki et al.
patent: 6715871 (2004-04-01), Hashimoto et al.
patent: 6734029 (2004-05-01), Furusawa
patent: 6803600 (2004-10-01), Yamazaki et al.
patent: 6822261 (2004-11-01), Yamazaki et al.
patent: 6861377 (2005-03-01), Hirai et al.
patent: 6953713 (2005-10-01), Yamazaki et al.
patent: 6977392 (2005-12-01), Yamazaki et al.
patent: 7148542 (2006-12-01), Yamazaki et al.
patent: 7223996 (2007-05-01), Yamazaki et al.
patent: 2001/0017683 (2001-08-01), Hiroki et al.
patent: 2002/0033906 (2002-03-01), Hiroki et al.
patent: 2003/0030689 (2003-02-01), Hashimoto et al.
patent: 2004/0043334 (2004-03-01), Kobayashi et al.
patent: 2004/0207777 (2004-10-01), Hiroki et al.
patent: 2005/0001965 (2005-01-01), Hiroki et al.
patent: 2005/0007329 (2005-01-01), Hiroki et al.
patent: 2005/0098782 (2005-05-01), Yamazaki et al.
patent: 2005/0112810 (2005-05-01), Kobayashi
patent: 2006/0048572 (2006-03-01), Isogai et al.
patent: 2006/0060860 (2006-03-01), Yamazaki et al.
patent: 2006/0134918 (2006-06-01), Fujii et al.
patent: 2006/0166411 (2006-07-01), Morisue et al.
patent: 2006/0169973 (2006-08-01), Isa et al.
patent: 2006/0170111 (2006-08-01), Isa et al.
patent: 2007/0096210 (2007-05-01), Yamazaki et al.
patent: 1312333 (2001-09-01), None
patent: 1479137 (2004-03-01), None
patent: 0499979 (1992-08-01), None
patent: 0502749 (1992-09-01), None
patent: 0 825 157 (1998-02-01), None
patent: 10-167763 (1993-06-01), None
patent: 10-259038 (1998-09-01), None
patent: 11-322363 (1999-11-01), None
patent: 2000-208899 (2000-07-01), None
patent: 2004-006700 (2004-01-01), None
patent: 2004-87977 (2004-03-01), None
patent: 2004-335849 (2004-11-01), None
Office Action (Chinese Application No. 200610004003.8), dated May 9, 2008.
Ding Yi, “Application of Conductive Ink for Electronic Components”, Screen Printing, 2004.1, pp. 27-33, with English Translation.
Chinese Office Action (Application No. 200610004003.8) dated May 8, 2009 with English Translation.
Office Action, (Application No. 200610004003.8; CN8500), Dated Nov. 7, 2008 with English translation.
Aoki Tomoyuki
Dairiki Koji
Costellia Jeffrey L.
Nixon & Peabody LLP
Semiconductor Energy Laboratory Co,. Ltd.
Toledo Fernando L
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