Substrate having microstrip line structure, semiconductor...

Details Substrate having microstrip line structure, semiconductor... Substrate having microstrip line structure, semiconductor...

2007-08-21

2007-08-21

Pascal, Robert (Department: 2817)

Wave transmission lines and networks

Long lines

Strip type

C333S243000, C333S246000, C333S247000

Reexamination Certificate

active

10926040

ABSTRACT:
A substrate having a microstrip line structure is provided comprising a trench provided at least in one main surface of a base body constituting the substrate having an inner surface geometry of an unbent curved surface and corresponding to the pattern of the microstrip line; a laminate film having a ground conductive layer and an insulating layer formed along the inner surface geometry of the trench; and a signal line layer constituting the microstrip line formed on the laminate film; where the signal line layer has a configuration separated for each trench.

REFERENCES:
patent: 5075655 (1991-12-01), Pond et al.
patent: 5510758 (1996-04-01), Fujita et al.
patent: 5652557 (1997-07-01), Ishikawa
patent: 5903239 (1999-05-01), Takahashi et al.
patent: 6720245 (2004-04-01), Stucchi et al.
patent: 07-336114 (1995-12-01), None

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