Incremental printing of symbolic information – Ink jet – Ejector mechanism
Patent
1995-03-28
2000-05-02
Le, N.
Incremental printing of symbolic information
Ink jet
Ejector mechanism
B41J 205
Patent
active
060563915
ABSTRACT:
A substrate for an ink jet head comprises a base member and an electrothermal converting body formed on the base member, the electrothermal converting body including a resistor layer and a pair of electrode layers connected to the resistor layer wherein the resistor layer positioned between a pair of the electrode layers serves as a heat generating portion for generating thermal energy utilized for discharging ink; wherein one of a pair of the electrode layers passes under the heat generating portion; an electrode layer positioned under the heat generating portion has a multi-layer structure composed of a plurality of layers; and at least one of a plurality of the layers, being nearest to the heat generating portion, is made of a metal having a melting point of 1500.degree. C. or more at 1 atm. An ink jet head using this substrate is able to prolong service life while reducing a failure ratio, and to continue preferable ink discharge for a long period of time.
REFERENCES:
patent: 4458256 (1984-07-01), Shirato et al.
patent: 4866460 (1989-09-01), Shiozaka
patent: 4947191 (1990-08-01), Nozawa et al.
patent: 5006867 (1991-04-01), Koizumi et al.
patent: 5081474 (1992-01-01), Shibata et al.
patent: 5420623 (1995-05-01), Tamura
Lewis, Hawley's Condensed Chemical Dictionary, 12thed, 1993.
Kasamoto Masami
Mori Toshihiro
Canon Kabushiki Kaisha
Le N.
Nguyen Judy
LandOfFree
Substrate having layered electrode structure for use in ink jet does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate having layered electrode structure for use in ink jet , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate having layered electrode structure for use in ink jet will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1588775