Substrate having gate recesses or slots and molding device and m

Details Substrate having gate recesses or slots and molding device and m Substrate having gate recesses or slots and molding device and m

1997-12-08

2000-01-11

Fahmy, Wael

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257782, 257787, 26427217, H01L 2302, H01L 2328

Patent

active

060139471

ABSTRACT:
The invention relates to a substrate having gate recesses or slots for the flow of molding resin, and related molding device and molding method in which said substrate is used. According to the invention, there is provided a substrate 10 having a multitude of chip pads 20 for mounting semiconductor chips, characterized in that gate recesses or slots 30 are formed along the resin routes 102 below the surface of the substrate 10 corresponding to the gate of mold 70, and the gate slots 30 extend from the edge of substrate 10 to the near part of the molded package 101.
And according to the invention, the molding device and molding methods which properly use the gate recesses or slotted substrate 10 are provided.

REFERENCES:
patent: 5371044 (1994-12-01), Yoshida et al.
patent: 5430331 (1995-07-01), Hamzehdoost et al.
patent: 5612576 (1997-03-01), Wilson et al.
patent: 5635671 (1997-06-01), Freyman et al.

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