Substrate having a multiple metal protected conductive layer and

Details Substrate having a multiple metal protected conductive layer and Substrate having a multiple metal protected conductive layer and

1991-12-04

1994-05-03

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 428210, B32B 900

Patent

active

053086864

ABSTRACT:
A substrate on which a protected conductive layer is formed. The conductive layer is formed by laminating together different kinds of conductive metal layers. A lowermost conductive metal layer of the conductive metal layers is formed on an insulating surface of a substrate body. A restraining structure contacts at least two conductive metal layers of the conductive metal layers. The restraining structure restrains elution of the conductive metal to prevent parts of the conductive metal from being eroded.

REFERENCES:
patent: 4521476 (1985-06-01), Asai et al.

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