Substrate handling system

Material or article handling – Apparatus for moving material between zones having different... – For carrying standarized mechanical interface type

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Details

414751, 414 222, 414609, 414416, 414286, 414331, 414749, 118729, 118500, 118 50, 187 16, C23C 1308

Patent

active

047767456

ABSTRACT:
A substrate handling system supplies new wafers to a vacuum chamber containing a lithography system, and outputs processed semiconductor wafers to an environment with normal atmospheric pressure. New wafers on a transplate pass by way of an air film track to a transload which feeds them from a load platform to a vacuum lock elevator. The inner door of the vacuum lock elevator opens and a completed transplate is transferred to the top shelf of the vacuum lock elevator. Next the vacuum lock elevator lifts to its upper position and the subsequent transfer of a new transplate onto a worktable occurs. There follows the closing of an inner door, (venting of the vacuum lock), the opening of an outer door, and the insertion of a new transplate from the load platform to the bottom shelf of the elevator. Finally, the completed transplate is removed. In cases where negative photoresists are used, this last step is replaced by routing the transplate to the post cure chamber for a period of up to 30 minutes.

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patent: 4643629 (1987-02-01), Takahashi et al.
patent: 4685852 (1987-08-01), Rubin et al.

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