Substrate grooves to reduce underfill fillet bridging

Details Substrate grooves to reduce underfill fillet bridging Substrate grooves to reduce underfill fillet bridging

2007-02-20

2007-02-20

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S125000, C438S126000, C257S778000, C257SE23021

Reexamination Certificate

active

10927568

ABSTRACT:
An apparatus having and method of forming grooves in the surface of a substrate adjacent and parallel to sidewall locations for circuit chips or die mounted on the surface. The grooves have physical dimensions to retain fill material formed between the packages and the surface of the substrate so that the fill material does not bridge between chips, thus reducing warping of the substrate due to mismatches in coefficient of thermal expansion (CTE) between the fill material, the substrate, the chips, and mold material formed over the substrate, under fill, and chips.

REFERENCES:
patent: 5218234 (1993-06-01), Thompson et al.
patent: 5558267 (1996-09-01), Humphrey et al.
patent: 5629566 (1997-05-01), Doi et al.
patent: 5855821 (1999-01-01), Chau et al.
patent: 6291264 (2001-09-01), Tang et al.
patent: 6426565 (2002-07-01), Bhatt et al.
patent: 6448507 (2002-09-01), Fontecha et al.
patent: 6853089 (2005-02-01), Ujiie et al.
patent: 2002/0084518 (2002-07-01), Hasebe et al.
patent: 2005/0051885 (2005-03-01), Weng et al.

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