Substrate grinding method and device

Details Substrate grinding method and device Substrate grinding method and device

2008-04-08

2010-12-07

Shechtman, Sean P (Department: 2121)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S072000, C700S170000, C700S174000, C700S175000, C700S193000, C700S303000, C702S097000, C702S170000, C451S011000, C438S005000

Reexamination Certificate

active

07848844

ABSTRACT:
A grinding method wherein the correlation between the amount of inertial grinding occurring in performing spark-out by a grinding unit and the maximum load current in a motor of the grinding unit is grasped, and a correction value for the amount of inertial grinding corresponding to the maximum load current is preliminarily obtained. When the wafer thickness measured by a thickness measuring gauge has reached the sum of a desired value and the correction value (=the amount of inertial grinding) corresponding to the maximum load current, the spark-out is started. Accordingly, the wafer thickness becomes the desired value after the inertial grinding in performing the spark-out.

REFERENCES:
patent: 4662120 (1987-05-01), Imai et al.
patent: 5402354 (1995-03-01), Okino et al.
patent: A 2003-300155 (2003-10-01), None

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