Substrate for use in semiconductor apparatus

Details Substrate for use in semiconductor apparatus Substrate for use in semiconductor apparatus

1982-07-14

1984-10-30

O'Keefe, Veronica

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428617, 428618, 428619, 428621, 428626, 428650, 428654, C23C 1700

Patent

active

044800134

ABSTRACT:
The invention relates to semiconductor chip mounting substrate for use in semiconductor apparatus, wherein metal material or multi-laminated metal material is coated on its surface and/or lateral faces with thin film of insulated inorganic matter in order to obtain an insulated substrate not only capable of efficiently radiating the heat developed in the semiconductor chip but also having thermal expansion coefficient approximate to that of the semiconductor chip, or further coated with film of Cu or Al so that the substrate is provided with high thermal conductivity and required thermal expansion characteristics thereby enabling to produce semiconductor apparatus highly effective for the acceleration of increase of density, reduction of size and improvement of radiation of IC.

REFERENCES:
patent: 3919717 (1975-11-01), Cullen et al.
patent: 3936577 (1976-02-01), Christini et al.
K. Agnihotri et al., Electronic Pkg. & Prod., pp. 179-185, Apr. 1981.
Koichi Nima et al., Semiconductor International, pp. 49-56, Apr. 1980.
Kyocera Packaging, Kyocera Ceramic Packages.

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