Substrate for transferring bumps and method of use

Details Substrate for transferring bumps and method of use Substrate for transferring bumps and method of use

1996-05-31

1999-01-19

Heinrich, Samuel M.

Metal fusion bonding

Process

Preplacing solid filler

438616, 427 96, H01L 2160

Patent

active

058605851

ABSTRACT:
A first pattern of bumps and a second pattern of bumps are formed on a substrate (10) with bumps (14,15). During a transfer process, only the bumps (14) of the first pattern of bumps are transferred to pad extensions (20) of a device (17). The bumps (15) of the second pattern of bumps are not affected by this process and can be later transferred to a second device.

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patent: 5447264 (1995-09-01), Koopman et al.
patent: 5616206 (1997-04-01), Sakatsu et al.

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