Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent
1998-06-01
1999-12-14
Jones, Deborah
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
428 641, 428 653, 428 85, 428 87, 428224, 428236, 428241, 428375, 428604, 428614, 428630, 228 11, 228 41, 228 62, 228 51, 228 563, 228 565, 228123, 2281791, 205123, 156235, 156241, 1562722, 156297, 1562739, H01L 2912
Patent
active
060014938
ABSTRACT:
A first pattern of bumps and a second pattern of bumps are formed on a substrate (10) with bumps (14,15). During a transfer process, only the bumps (14) of the first pattern of bumps are transferred to pad extensions (20) of a device (17). The bumps (15) of the second pattern of bumps are not affected by this process and can be later transferred to a second device.
REFERENCES:
patent: 3516155 (1970-06-01), Smith
patent: 3719981 (1973-03-01), Steitz
patent: 4396140 (1983-08-01), Jaffe et al.
patent: 4832255 (1989-05-01), Bickford et al.
patent: 5217597 (1993-06-01), Moore et al.
patent: 5237269 (1993-08-01), Aimi et al.
patent: 5374893 (1994-12-01), Koopman et al.
patent: 5381946 (1995-01-01), Koopman et al.
patent: 5425493 (1995-06-01), Interrante et al.
patent: 5440239 (1995-08-01), Zappella et al.
patent: 5447264 (1995-09-01), Koopman et al.
patent: 5616206 (1997-04-01), Sakatsu et al.
Jen-Ho Wang James
Kaskoun Kenneth
Rutledge James L.
Bahta Abraham
Jones Deborah
Martinez Anthony M.
Motorola Inc.
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