Substrate for solder joint

Details Substrate for solder joint Substrate for solder joint

2007-05-29

2007-05-29

Pizarro, Marcos D. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257S738000, C257S780000, C257SE23010

Reexamination Certificate

active

10848649

ABSTRACT:
A substrate for solder joint is provided, including: a core layer; at least one conductive trace formed on the core layer and having a circular terminal as a pad through which a plurality of hollow portions are formed and expose predetermined portions of the core layer underneath the pad, wherein the hollow portions are arranged at equal intervals and spaced from a periphery of the circular pad; and a solder mask for covering the conductive trace and having at least one opening bordered across each of the hollow portions of the pad, such that part of the pad and part of each of the predetermined portions of the core layer are exposed via the opening, to allow a conductive element to be bonded to the exposed part of the pad and the exposed part of the predetermined portions of the core layer in the opening of the solder mask.

REFERENCES:
patent: 5872399 (1999-02-01), Lee
patent: 6201305 (2001-03-01), Darveaux et al.
patent: 6762503 (2004-07-01), Lee
patent: 7005750 (2006-02-01), Liu

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