Substrate for semiconductor device, semiconductor device using t

Details Substrate for semiconductor device, semiconductor device using t Substrate for semiconductor device, semiconductor device using t

1998-05-28

2000-02-08

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

438106, 438124, 438126, H01L 2144, H01L 2148, H01L 2150

Patent

active

06022763&

ABSTRACT:
A one-sided sealed type semiconductor device comprising a substrate proper for a one-sided resin mold provided on the first main surface thereof with a wiring circuit including connection parts for semiconductor elements and on the second main surface thereof with flat type external connection terminals led out thereon via a through hole, semiconductor elements set in place and packaged in predetermined areas of the first main surface of the substrate proper, a transfer mold resin layer for sealing solely the surface having the semiconductor elements packaged thereon, and a metallic layer formed on the first main surface independently of wiring circuit and outside the area having the wiring circuit.

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E. Harari, Nikkei Electronics, Feb. 17, 1992, pp. 155-168.

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