Substrate for semiconductor apparatus

Details Substrate for semiconductor apparatus Substrate for semiconductor apparatus

1994-08-02

1995-04-25

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437247, H01L 2160

Patent

active

054098645

ABSTRACT:
This invention relates to a substrate for mounting a semiconductor chip in an integrated circuit wherein a sintered compact containing copper at 2 to 30 wt. % and tungsten and/or molybdenum is employed as a substrate which efficiently radiates heat developed from the semiconductor chip mounted thereon and said substrate having a thermal expansion coefficient similar to those of semiconductor chip and other enclosure materials.

REFERENCES:
patent: 1552184 (1925-09-01), Adams
patent: 1848437 (1932-03-01), Sieger et al.
patent: 1860793 (1932-05-01), Weiger
patent: 2763822 (1956-09-01), Frola et al.
patent: 2971251 (1961-02-01), Willemse
patent: 3097329 (1963-07-01), Siemens
patent: 3204158 (1965-08-01), Schreiner et al.
patent: 3423203 (1969-01-01), Zdanuk et al.
patent: 3969754 (1976-07-01), Kuniya et al.
patent: 4196442 (1980-04-01), Kuniya et al.
patent: 4427993 (1984-01-01), Fichot et al.
patent: 4451540 (1984-05-01), Baird et al.
patent: 4680618 (1987-07-01), Kuroda et al.
patent: 5086333 (1992-02-01), Osada et al.
patent: 5099310 (1992-03-01), Osada et al.
German, Liquid Phase Sintering, N.Y. and London, 1985, pp. 160-163.
Jones, Fundamendal Principles of Powder Metallurgy, London, 1960, pp. 504-509, 770-773.
Sands, et al., Powder Metallurgy Practice and Applications, London, 1966, pp. 94-95.
Kosco, "New Low expansion alloys for semiconductor applications", Solid State Technology, Jan. 1969, pp. 47-49.
Hirschhorn, Introduction to Powder Metallurgy, N.Y., 1969, pp. 244-245.
Meyer, "How to Select Electrical Contacts", Metal Progress, US, vol. 88, Jun./1965-Dec./1965, pp. 92-95.
Yih and Wang, Tungsten, Sources, Metallurgy, Properties and Applications, New York and London, 1979, pp. 362-363.
Shinbun, Powder Metallurgy and Sintered Materials, Japan, 1964, pp. 264-267.
Benesovsky, Powder Metallurgy and Sintered Materials, Metallwerk Plansee AG & Co.KG, Germany, 1973, pp. 146-156.
Elmet Contact Materials, Metallwerk Plansee AG & Co., Germany, 1977.
Benesovsky, Powder Metallurgy and Sintered Materials, Metallwerk Plansee AG & Co., Germany, 1973, pp. 10-11.
Elkonite Data Book, P. R. Mallory & Co., Indianapolis, Ind., 1941, pp. 1 -30.
Resistance Welding Data Book, P. R. Mallory & Co., Indianapolis, Ind., 1951. pp. 308-309.
Mallory catalog, P. R. Mallory & Co., Indianapolis, Ind., 1950, pp. 30-33.
Mallory Product Guide, P. R. Mallory & Co., Indianapolis, Ind., 1962, p. 22.
Elkonite Refractory Metal Composites Catalog, P. R. Mallory & Co., Indianapolis, Ind., 1962.
Elkonite Refractory Metal Composites Catalog, P. R. Mallory & Co., Indianapolis, Ind., 1968.
Elkonite Catalog, Contact Metals Welding Inc., Indianapolis, Ind., 1981, pp. 308-309.
Thermkon Catalog, Contact Metals Welding Inc., Indianapolis, Ind., 1982 (Copyright Registration Sep. 27, 1982.
Thermkon Trademark Registration No. 1,354,948, Aug. 20, 1985.
Thermkon Catalog, Contact Metals Welding Inc., Indianapolis, Ind., 1987.

Affiliated with

Also associated with

Rating

Substrate for semiconductor apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate for semiconductor apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate for semiconductor apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1567383