Substrate for semiconductor apparatus

Details Substrate for semiconductor apparatus Substrate for semiconductor apparatus

1995-01-04

1996-06-11

Jordan, Charles T.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

428552, 257684, 257729, 257712, 257717, 437209, 437247, B22F 704

Patent

active

055254284

ABSTRACT:
This invention relates to a substrate for semiconductor apparatus loading a semiconductor chip in an integrated circuit apparatus and is characterized in that a sintered compact containing copper of 2 to 30 wt. % in tungsten and/or molybdenum is used as the substrate having the heat radiation capable of efficiently radiating heat developed from the loaded semiconductor chip and thermal expansion coefficient similar to those of semiconductor chip and other enclosure material except for the substrate.

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